- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
Patent holdings for IPC class H01R 12/73
Total number of patents in this class: 1238
10-year publication summary
100
|
88
|
115
|
149
|
175
|
145
|
155
|
95
|
103
|
40
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
TE Connectivity Solutions GmbH | 2580 |
78 |
Molex, LLC | 1792 |
65 |
Amphenol Corporation | 748 |
46 |
Foxconn Interconnect Technology Limited | 1034 |
45 |
Japan Aviation Electronics Industry, Limited | 1585 |
43 |
Intel Corporation | 45621 |
41 |
Hirose Electric Co., Ltd. | 325 |
27 |
Samsung Electronics Co., Ltd. | 131630 |
23 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
21 |
Dell Products L.P. | 11144 |
18 |
Apple Inc. | 50209 |
17 |
Huawei Technologies Co., Ltd. | 100781 |
17 |
Lotes Co., Ltd. | 346 |
17 |
Rosenberger Hochfrequenztechnik GmbH & Co. KG | 677 |
17 |
FCI USA LLC | 200 |
16 |
Foxconn (Kunshan) Computer Connector Co., Ltd. | 286 |
16 |
Murata Manufacturing Co., Ltd. | 22355 |
15 |
Kyocera Corporation | 12735 |
14 |
Amphenol Commercial Products (ChengDu) Co. LTD | 62 |
14 |
Hewlett Packard Enterprise Development LP | 10702 |
13 |
Other owners | 675 |